HSP061-4M10 Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
HSP061-4M10 Datasheet PDF : 10 Pages
| |||
HSP061-4M10
Recommendation on PCB assembly
3
Recommendation on PCB assembly
Figure 13. μQFN-10L dimension definitions
10 µm
10 µm
15 µm
5 µm
Copper
Thic kness:
100 µm
Stencil wind ow
Footprin t
5 µm
15 µm
380 µm
400 µm
15 µm
190 µm
200 µm
15 µm
3.1
Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Solder paste with fine particles: powder particle size is 20-45 μm.
3.2
Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste
and cause solder joints to short. Too low placement force can lead to insufficient contact between package
and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high
resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder
paste printing, pick and place and reflow soldering by using optimized tools.
DS9279 - Rev 4
page 6/10
Share Link: 