HSDL-3209 Ver la hoja de datos (PDF) - HP => Agilent Technologies
Número de pieza
componentes Descripción
Fabricante
HSDL-3209 Datasheet PDF : 16 Pages
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Order Information
Part Number
HSDL-3209-021
Packaging Type
Tape and Reel
Package
Front View
Quantity
2500
I/O Pins Configuration Table
Pin Symbol Description
1 LED A LED Anode
I/O Type
Input
2 RXD Receive Data Output,
Active Low
3 TXD Transmit Data Input,
Active High
4 SD
Shutdown
Input,
Active High
5 IOVcc Input/Output Input/Output
ASIC Vcc
Active High
6 Vcc
Supply Voltage Supply Voltage
7 GND Ground
Ground
Function
Tied through external resistor, R1, to VLED from 2.4V to 4.5V.
Please refer to Table 1 for VLED versus Series Resistor, R1.
This pin is capable of driving a standard CMOS or TTL load.
No external pull-up or pull down resistor is required. It is in
tri-state mode when the transceiver is in shutdown mode.
This pin is used to transmit serial data when SD pin is low.
If held high longer than ~ 50µs, the LED will be turned off.
The transceiver is in shutdown mode if this pin is high
Connect to ASIC logic controller Vcc Voltage as low as 1.5V.
Regulated, 2.4 to 3.6 Volts.
Connect to system ground.
Recommended Application Circuit Components
Component
R1
CX1, CX4
CX2, CX3
Recommended Value
15Ω±5%, 0.0625 Watt for 2.4 ≤ Vled ≤ 2.7V
27Ω±5%, 0.0625 Watt for 2.7 < Vled ≤ 3.6V
36Ω±5%, 0.0625 Watt for 3.6 < Vled ≤ 4.5V
0.47 µF ± 20%, X7R Ceramic
6.8 µF ± 20%, X7R Ceramic or Tantalum
Notes:
1. CX1, CX2, CX3 and CX4 must be placed within 0.7 cm of the HSDL-3209 to obtain optimum noise immunity.
Note
1
1
CAUTIONS: The CMOS inherent to the design of this component increases the component’s
susceptibility to damage from the electrostatic discharge (ESD). It is advised that normal
static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD
2
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