HSDL-3203-021 Ver la hoja de datos (PDF) - HP => Agilent Technologies

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HSDL-3203-021

Small Profile Package IrDA® Data Compliant Low Power 115.2 kbit/s Infrared Transceiver

HP => Agilent Technologies 

Moisture-Proof Packaging

All HSDL-3203 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 25°C,

AND LESS THAN

60% RH?

NO

PACKAGE IS

OPENED MORE

THAN 2 DAYS?

YES

YES

NO BAKING

IS NECESSARY

NO

PERFORM RECOMMENDED

BAKING CONDITIONS

Figure 12. Baking conditions chart.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Packaging Temp. Time

In Reels

In Bulk

60˚C

100˚C

125˚C

150˚C

≥ 48 hours

≥ 4 hours

≥ 2 hours

≥ 1 hour

Baking should only be done once.

Recommended Storage Conditions

Storage Temp.

10˚C to 30˚C

Relative Humidity Below 60% RH

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

two days if stored at the recom-

mended storage conditions. If

times longer than two days are

needed, the parts must be stored

in a dry box.

9

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