HSDL-3203-021 Ver la hoja de datos (PDF) - HP => Agilent Technologies

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HSDL-3203-021

Small Profile Package IrDA® Data Compliant Low Power 115.2 kbit/s Infrared Transceiver

HP => Agilent Technologies 

Reflow Profile

255

230

220

200

180

R2

160

120

R1

MAX. 260°C

R3

R4

60 sec.

MAX.

ABOVE

220°C

R5

80

25

0

50

100

150

200

250

300

P1

HEAT

UP

t-TIME (SECONDS)

P2

SOLDER PASTE DRY

P3

SOLDER

REFLOW

P4

COOL

DOWN

Figure 13. Reflow graph.

Process Zone

Heat Up

Solder Paste Dry

Solder Reflow

Cool Down

Symbol

P1, R1

P2, R2

P3, R3

P3, R4

P4, R5

∆T

25˚C to 160˚C

160˚C to 200˚C

200˚C to 255˚C (260˚C at 10 seconds max.)

255˚C to 200˚C

200˚C to 25˚C

Maximum ∆T/∆time

4˚C/s

0.5˚C/s

4˚C/s

–6˚C/s

–6˚C/s

The reflow profile is a straight

line representation of a nominal

temperature profile for a convec-

tive reflow solder process. The

temperature profile is divided

into four process zones, each

with different ∆T/∆time tempera-

ture change rates. The ∆T/∆time

rates are detailed in the above

table. The temperatures are

measured at the component to

printed circuit board connections.

In process zone P1, the PC board

and HSDL-3203 castellation I/O

pins are heated to a temperature

of 160°C to activate the flux in

the solder paste. The temperature

ramp up rate, R1, is limited to

4°C per second to allow for even

heating of both the PC board and

HSDL-3203 castellation I/O pins.

Process zone P2 should be of

sufficient time duration (60 to

120 seconds) to dry the solder

paste. The temperature is raised

to a level just below the liquidus

point of the solder, usually 200°C

(392°F).

Process zone P3 is the solder

reflow zone. In zone P3, the tem-

perature is quickly raised above

the liquidus point of solder to

255°C (491°F) for optimum

results. The dwell time above the

liquidus point of solder should be

between 20 and 60 seconds. It

usually takes about 20 seconds to

assure proper coalescing of the

solder balls into liquid solder and

the formation of good solder

connections. Beyond a dwell

time of 60 seconds, the inter-

metallic growth within the solder

connections becomes excessive,

resulting in the formation of weak

and unreliable connections. The

temperature is then rapidly

reduced to a point below the

solidus temperature of the solder,

usually 200°C (392°F), to allow

the solder within the connections

to freeze solid.

Process zone P4 is the cool down

after solder freeze. The cool

down rate, R5, from the liquidus

point of the solder to 25°C (77°F)

should not exceed 6°C per second

maximum. This limitation is nec-

essary to allow the PC board and

HSDL-3203 castellation I/O pins

to change dimensions evenly,

putting minimal stresses on the

HSDL-3203 transceiver.

10

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