HPL1117 Ver la hoja de datos (PDF) - Unspecified
Número de pieza
componentes Descripción
Fabricante
HPL1117 Datasheet PDF : 19 Pages
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HPL1117
Carrier Tape & Reel Dimension
A p p lica tio n
TO -252
A
330 ±3
F
B
100 ± 2
D
C
13 ± 0. 5
D1
J
2 ± 0 .5
Po
T1
16 .4 + 0.3
-0 .2
P1
T2
2.5± 0.5
Ao
W
1 6 + 0 .3
- 0 .1
Bo
P
8 ± 0 .1
Ko
E
1 .75 ± 0.1
t
7 .5 ± 0 .1 1 .5 + 0.1 1 .5 ± 0 .2 5 4 .0 ± 0 .1 2 .0 ± 0 .1 6 .8 ± 0 .1 1 0 .4 ± 0 .1 2 .5 ± 0 .1 0 .3 ± 0 .0 5
A p p lica tio n
A
380±3
TO -263
F
11 .5 ± 0 .1
A p p lica tio n
A
330±1
S O T -223
F
B
80 ± 2
D
1 .5 + 0.1
B
6 2 ±1 .5
D
C
13 ± 0. 5
D1
1.5± 0 .25
C
1 2 .7 5±
0 .1 5
D1
J
2 ± 0 .5
Po
T1
24 ± 4
P1
T2
2± 0.3
Ao
W
24 + 0.3
- 0 .1
Bo
4 .0 ± 0 .1 2 .0 ± 0 .1 1 0 .8 ± 0.1 1 6 .1 ± 0 .1
J
T1
T2
W
2 ± 0 .6 1 2 .4 +0 .2 2± 0.2 12 ± 0 .3
Po
P1
Ao
Bo
P
E
16 ± 0 .1 1 .7 5 ± 0.1
Ko
5.2± 0 .1
P
t
0 .3 5 ± 0 .0 1
3
E
8 ± 0 .1 1 .7 5 ± 0.1
Ko
t
5 .5 ± 0 .0 5 1 .5 + 0.1 1 .5 + 0.1 4 .0 ± 0 .1 2 .0 ± 0 .0 5 6 .9 ± 0 .1 7 .5 ± 0 .1 2 .1 ± 0 .1 0 .3 ± 0 .0 5
Cover Tape Dimensions
Application
TO- 252
TO- 263
SOT- 223
Carrier Width
16
24
12
Cover Tape Width
13.3
21.3
9.3
Devices Per Reel
2500
1000
2500
CONTACT
HIPAC Semiconductor, Inc.
2540 North First Street, Suite 308
San Jose, CA 95131-1016
U.S.A.
Tel: 1-408-943-0808
Fax: 1-408-943-0878
E-Mail: info@hipacsemi.com
Copyright HIPAC Semiconductor, Inc.
19
Rev. B.13 - Mar., 2004
www.hipacsemi.com
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