HDMP-0480 Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza

componentes Descripción

Fabricante

HDMP-0480

Octal Cell Port Bypass Circuit without Clock and Data Recovery

HP => Agilent Technologies 

Package Information

HDMP-0480 Thermal Characteristics, TC = 0°C to +85°C, VCC = 3.15V to 3.45V

Symbol Parameter

Unit

Typ.

Max.

θjc

Thermal Resistance, Junction to Case °C/W

10

—

Note: Based on independent testing by Agilent. θja for these devices is 56°C/W for the HDMP-0480.

θja is measured on a standard 3x3” FR4 PCB in a still air environment. To determine the actual

junction temperature in a given application, use the following equation: Tj = TC + (θjc x PD), where TC

is the case temperature measured on the top center of the package, and PD is the power being

dissipated.

Item

Package Material

Lead Finish Material

Lead Finish Thickness

Lead Skew

Lead Coplanarity

(Seating Plane Method)

Details

Plastic

85% Tin, 15% Lead

300 – 800 micro-inches

0.08 mm max.

0.08 mm max.

Pin #1 ID

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

1

48

2

47

3

46

4

45

5

44

6

43

7

42

8

41

9

40

10

39

11

38

12

37

13

36

14

35

15

34

16

33

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

10.00 ± 0.10

13.20 ± 0.25

10.00 ± 0.10

13.20 ± 0.25

Top View

2.00 + 0.10,

- 0.05

2.45 MAX.

0.25 MIN.

All dimensions shown in mm

Seating

Plane

Figure 6. HDMP-0480 Package Drawing.

9

0.22 ± 0.05

0.50

BASIC

0.17 MAX.

0.88

+ 0.15, - 0.10

0.25

Gauge

Plane

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