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Número de pieza
componentes Descripción
HCTS74D Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
HCTS74D
Radiation Hardened Dual-D Flip-Flop with Set and Reset
Intersil
HCTS74D Datasheet PDF : 10 Pages
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Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
D1
(2)
HCTS74MS
HCTS74MS
R1
(1)
VCC
(14)
CP1 (3)
NC
S1 (4)
Q1 (5)
(13) R2
(12) D2
NC
(11) CP2
Q1 (6)
(10) S2
(7)
(8)
(9)
GND
Q2
Q2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS74 is TA14438A.
Spec Number
518626
468
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