FOD852 Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza

componentes Descripción

Fabricante

FOD852

4-Pin High Operating Temperature Photodarlington Optocoupler

Fairchild Semiconductor 

Lead Free Recommended IR Reflow Condition

Tp

Tsmax

Tsmin

Ramp-down

25°C

Profile Feature

Preheat Conditions

Temperature: Tsmin to Tsmax

Time: tS

Melt Soldering Zone

Peak Temperature (Tp)

Ramp-down Rate

tS (Preheat)

Time (sec)

Soldering zone

Figure 16. Reflow Profile

Pb-Sn solder assembly

100°C to 150°C

60 to 120 seconds

183°C

60 to 120 seconds

240 +0°C/-5°C

6°C/s maximum

Lead Free assembly

150°C to 200°C

60 to 120 seconds

217°C

30 to 90 seconds

260 +0°C/-5°C

6°C/s maximum

Recommended Wave Soldering Condition

Profile Feature

For all Solder Assembly

Peak Temperature (Tp)

Maximum 260°C for 10 seconds

©2006 Fairchild Semiconductor Corporation

FOD852 Rev. 1.2.2

7

www.fairchildsemi.com

Share Link: