FOD063L Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FOD063L Datasheet PDF : 14 Pages
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8-Pin DIP
Package Dimensions (Through Hole)
4
3
5
6
2
1
7
8
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
15° MAX
0.300 (7.62)
TYP
Package Dimensions (Surface Mount)
0.390 (9.91)
0.370 (9.40)
4
3
2
1
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.140 (3.55)
0.020 (0.51)
MIN
0.300 (7.62)
TYP
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.045 [1.14]
0.315 (8.00)
MIN
0.405 (10.30)
MIN
0.016 (0.41)
0.008 (0.20)
Package Dimensions (0.4” Lead Spacing)
8-Pin DIP
4
3
2
1
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.004 (0.10) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
0.070 (1.78)
0.060 (1.52)
0.295 (7.49)
0.415 (10.54)
0.100 (2.54)
0.030 (0.76)
©2008 Fairchild Semiconductor Corporation
FOD060L, FOD260L, FOD063L Rev. 1.0.3
10
www.fairchildsemi.com
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