FAN2564 Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza

componentes Descripción

Fabricante

FAN2564

300mA Low VIN LDO for Digital Applications

Fairchild Semiconductor 

Physical Dimensions

0.10 C

2X

2.0

A

B

2.0

PIN1

IDENT

TOP VIEW

0.10 C

2X

0.55 MAX

0.10 C

0.08 C 0.05

0.00

SEATING

PLANE

(0.15)

C

SIDE VIEW

PIN1

IDENT

1.50

MAX

1

3

6x

0.35

0.25

1.10

MAX

6

0.65

4

0.35

0.25

6x

1.30

0.10 C A B

0.05 C

BOTTOM VIEW

0.50

1.60

1.50

6

4

1.10

1.40 2.40

1

0.65

3

0.30

RECOMMENDED LAND PATTERN

NOTES:

A. OUTLINE BASED ON JEDEC REGISTRATION

MO-229, VARIATION VCCC.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. DRAWING FILENAME: MKT-UMLP06Crev1

Figure 27. 6-Pin, Ultrathin Molded Leadless Package (UMLP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, spe-

cifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

© 2007 Fairchild Semiconductor Corporation

FAN2564 • Rev. 1.0.2

12

www.fairchildsemi.com

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