4543ILZ Ver la hoja de datos (PDF) - Intersil

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componentes Descripción

Fabricante

4543ILZ

Triple Differential Twisted-Pair Driver with Common-Mode Sync Encoding

Intersil 

Typical Performance Curves (Continued)

EL4543

FIGURE 31. HARMONIC DISTORTION

JEDEC JESD51-7 HIGH EFFECTIVE

THERMAL CONDUCTIVITY TEST BOARD

1.4

1.136W

1.2

1

0.8

0.6

θJA =8Q8S°CO/PW24

0.4

0.2

0

0

25 50 75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 33. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD - QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

3

2.500W

2.5

2

1.5

θJA(4=m40m°QCx/FW4Nm2m0 )

1

0.5

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 35. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

10

FIGURE 32. HARMONIC DISTORTION

JEDEC JESD51-3 LOW EFFECTIVE

THERMAL CONDUCTIVITY TEST BOARD

1.2

1 870mW

0.8

0.6

0.4

θJA =1Q1S5O°CP/W24

0.2

0

0

25 50 75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 34. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-3 AND SEMI G42-88 (SINGLE

LAYER) TEST BOARD

0.8

0.7 667mW

0.6

0.5

0.4

θJA(4=m15m0°QxCF/4WNm2m0 )

0.3

0.2

0.1

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 36. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FN7325.5

October 26, 2005

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