FTF3020-C Ver la hoja de datos (PDF) - Philips Electronics

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componentes Descripción

Fabricante

FTF3020-C

Full Frame CCD Image Sensor

Philips Electronics 

Philips Semiconductors

Full Frame CCD Image Sensor

Package information

SENSOR CRYSTAL

COVER GLASS

EPOXY GLUE

A

TOP VIEW

INDEX

MARK

PIN 1

26.35 ±0.15

52.7 ±0.53

Product specification

FTF3020-C

Top cover glass to top chip 2.4 ±0.25

Chip - bottom package 1.7 ±0.15

Chip - cover glass 1.3 ±0.20

Cover glass 1.0 ±0.05

Image sensor chip

1.4 / 100

COVER GLASS

STAND-OFF PIN

(2.54)

BOTTOM VIEW

0.46 ±0.05

A is the center of the image area.

Position of A:

26.35 ± 0.15 to left edge of package

20.00 ± 0.15 to upper edge of package

1.7 ± 0.15 to bottom of package

Angle of rotation: less than ± 1°

Sensor flatness: < 20 µm (P-V)

Cover glass: Corning 7059

Thickness of cover glass: 1 ± 0.05

Refractive index: nd = 1.53

Double sided AR coating < 1% (430-660 nm) reflection

48.26 ±0.27

All drawing units are in mm

Figure 13 - Mechanical drawing of the PGA package of the FTF3020-C

1999 November

15

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