DF17 Ver la hoja de datos (PDF) - HIROSE ELECTRIC

Número de pieza

componentes Descripción

Fabricante

DF17

0.5mm Pitch Board to Board Connector

HIROSE ELECTRIC 

s Precautions

1. Recommended

Temperature Profile

(SMT)

Temperature

250ç

200ç

IR reflow condition

Preheating area 150ç for 100 to 120 seconds

Soldering area 235ç5ç for 10 seconds max.

220ç min for 10 to 30 seconds

150ç

100ç

50ç

Preheating area

240ç max.

220ç

Soldering area

0ç

0SSEC

50SSEC

100SSEC

150SSEC

200SSEC Time

Note 1. Maximum twice action is allowed under the same condition. However, the interval between

the first and second actions must be maintained at the room temperature.

Note 2.The temperature indicates the board surface temperature of the connector lead area.

2. Recommended Manual

Soldering Condition

(SMT)

Soldering iron temperature: 290±10çoldering time: Within 2 seconds

3. Recommended

Screen Thickness

(SMT)

0.15mm

4. Board Warp(SMT)

Max 0.2mm in the connector center area, based on the both connector edges

5. Cleaning Condition

Refer to the "Nylon Connector Use Hand book".

6. Cautions

s The header is designed in a structure where contacts are exposed. Touching it with bare

hands would cause contact failure or electrostatic element damage.

s Where no board is mounted, the insertion or extraction will cause damage or contact deformation.

s Avoid retaining the board with the connector only, and fix the board by any other means than the connector.

s Excessive scoop insertion or extraction may result in damage.

s In the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.

s The color phase of this product may be slightly different from that of the formed product

according to the manufacturing lot. However, the difference doesn't affect the performance.

A330

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