NX29F010-70PLI Ver la hoja de datos (PDF) - NexFlash -> Winbond Electronics

Número de pieza

componentes Descripción

Fabricante

NX29F010-70PLI

1M-BIT (128K x 8-bit) CMOS, 5.0V Only ULTRA-FAST SECTORED FLASH MEMORY

NexFlash -> Winbond Electronics 

NX29F010

PACKAGING INFORMATION

Plastic TSOP - 32-pins

Package Code: T (Type I)

1

EH

N

D

SEATING PLANE

S

A

e

B

A1

L

α

C

Plastic TSOP (T—Type I)

Millimeters

Inches

Symbol Min Max

Min Max

Ref. Std.

No. Leads

32

A

– 1.20

A1

0.05 0.15

B

0.17 0.27

C

0.10 0.21

D

7.90 8.10

E

18.30 18.50

H

19.80 20.20

e

0.50 BSC

L

0.50 0.70

a

0° 5°

– 0.047

0.002 0.005

0.007 0.009

0.004 0.008

0.308 0.316

0.714 0.722

0.772 0.788

0.020 BSC

0.016 0.024

0°

5°

22

Notes:

1. Controlling dimension: millimeters, unless

otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold

flash protrusions and should be measured

from the bottom of the package.

4. Formed leads shall be planar with respect to

one another within 0.004 inches at the

seating plane.

NexFlash Technologies, Inc.

NXPF001F-0600

06/22/00 ©

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