NX29F010-45PLI Ver la hoja de datos (PDF) - NexFlash -> Winbond Electronics

Número de pieza

componentes Descripción

Fabricante

NX29F010-45PLI

1M-BIT (128K x 8-bit) CMOS, 5.0V Only ULTRA-FAST SECTORED FLASH MEMORY

NexFlash -> Winbond Electronics 

NX29F010

PACKAGING INFORMATION

600-mil Plastic DIP

Package Code: W

N

1

S

L

e

D

B1

B

E1

SEATING PLANE

A

E

C

A1

α

eA

600-mil Plastic DIP (W)

Inches

Symbol Min Max Min Max Min Max

Ref. Std.

N

28

32

40

A 0.160 0.185 0.165 0.180 0.165 0.200

A1 0.020 0.030 0.010 — 0.020 0.045

B 0.015 0.020 0.018 0.015 0.022

B1 0.050 0.065 0.050 0.045 0.067

C 0.008 0.012 0.010 0.008 0.015

D 1.420 1.460 1.645 1.655 2.045 2.055

E 0.600 0.620 0.590 0.610 0.600 0.620

E1 0.530 0.555 0.540 0.555 0.530 0.560

eA 0.610 0.660 0.620 0.680 0.600 0.680

e 0.100 BSC 0.100 BSC 0.100 BSC

L 0.120 0.150 0.120 0.140 0.120 0.138

S 0.055 0.080 0.065 0.085 0.055 0.085

a 0° 15° 2° 8° — —

NexFlash Technologies, Inc.

NXPF001F-0600

06/22/00 ©

Notes:

1. Controlling dimension: inches, unless otherwise

specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash

protrusions and should be measured from the

bottom of the package.

4. Formed leads shall be planar with respect to one

another within 0.004 inches at the seating plane.

21

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