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NX29F010 Ver la hoja de datos (PDF) - NexFlash -> Winbond Electronics

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NX29F010 Datasheet PDF : 25 Pages
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NX29F010
AC ELECTRICAL CHARACTERISTICS
Std.
Symbol Parameter
tWC Write Cycle Time(1)
-35
Min. Max.
35
tAS Addess Setup Time
0
tAH Address Hold Time
30
tDS Data Setup Time
20
tDH Data Hold Time
0
tOES Output Enable Setup Time(1)
0
tGHWL Read Recovery Time Before Write 0
tWS Write Enable Setup Time
0
tWH Write Enable Hold Time
0
tCP Chip Enable Pulse Width
20
tCPH Chip Enable Pulse Width HIGH
20
tWHWH1 Byte Programming Operation(2)
20
tWHWH2 Sector Erase Operation(2)
1.0
-45
Min. Max.
45
0
35
20
0
0
0
0
0
25
20
20
1.0
-55
Min. Max.
55
0
45
20
0
0
0
0
0
30
20
20
1.0
Note:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
-70
Min. Max.
70
0
45
30
0
0
0
0
0
35
20
20
1.0
-90
Min. Max. Unit
90 ns
0 ns
45 ns
45 ns
0 ns
0 ns
0 ns
0 ns
0 ns
45 ns
20 ns
20 µs
1.0 sec
555H FOR PROGRAM
2AAH FOR ERASE
PA FOR PROGRAM
SA FOR SECTOR ERASE
555H FOR CHIP ERASE
DATA# POLLING
ADDRESS
WE
OE
CE
DATA
tWC
tAS
tAH
tWH
tGHEL
tCPH
tCP
VA
tWHWH1 OR 2
tWS
tDH
tDS
A0H FOR PROGRAM
55H FOR ERASE
PD FOR PROGRAM
30H FOR ERASE
10H FOR CHIP ERASE
DQ7# DOUT
Note:
Figure 17. AC Waveform:
1. PA = Program Address, PD = Program Data, SA = Sector Address, DQ7# = Complement of Data Input, DOUT = Array Data.
2. Figure indicates the last two bus cycles of the command sequence.
NexFlash Technologies, Inc.
19
NXPF001F-0600
06/22/00 ©

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