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Número de pieza
componentes Descripción
DIM200PHM33-A000 Ver la hoja de datos (PDF) - Dynex Semiconductor
Número de pieza
componentes Descripción
Fabricante
DIM200PHM33-A000
Half Bridge IGBT Module
Dynex Semiconductor
DIM200PHM33-A000 Datasheet PDF : 10 Pages
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DIM200PHM33-A000
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Nominal weight: 750g
Module outline type code: P
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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www.dynexsemi.com
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