CXA2550M Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXA2550M Datasheet PDF : 15 Pages
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Package Outline
CXA2550M
Unit: mm
20PIN SOP (PLASTIC) 300mil
+ 0.4
12.45 – 0.1
20
11
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
10
1.27
+ 0.1
0.2 – 0.05
SCT Ass'y
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-20P-L01
∗SOP020-P-0300-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
COPPER ALLOY
0.3g
20PIN SOP (PLASTIC) 300mil
+ 0.4
12.45 – 0.1
20
11
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
10
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-20P-L01
∗SOP020-P-0300-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
COPPER ALLOY
0.3g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
– 14 –
CXA2550M/N
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