CXA1101P Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXA1101P Datasheet PDF : 15 Pages
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Package Outline
Unit: mm
CXA1101P, CXA1101P
CXA1102P, CXA1163P
16PIN DIP (PLASTIC) 300mil
+ 0.4
19.2 – 0.1
16
9
1
8
2.54
CXA1100/CXA1101/CXA1102/CXA1163
0° to 15°
16PIN DIP (PLASTIC) 300mil
+ 0.4
19.1 – 0.1
16
9
1
8
2.54
0° to 15°
0.5 ± 0.1
1.2 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-01
∗DIP016-P-0300-A
Similar to MO-001-AE
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
SOLDER PLATING
COPPER
1.0 g
0.46 ± 0.1
1.53 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-03
∗DIP016-P-0300-B
Similar to MO-001-AE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE WEIGHT
COPPER / 42 ALLOY
1.0g
CXA1101M, CXA1102M
CXA1163M
16PIN SOP (PLASTIC) 300mil
+ 0.4
9.9 – 0.1
16
9
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
8
1.27
+ 0.1
0.2 – 0.05
SONY CODE
EIAJ CODE
SOP-16P-L01
∗SOP016-P-0300-A
JEDEC CODE
± 0.12 M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.2g
CXA1100P, CXA1101P
CXA1102P
16PIN DIP (PLASTIC) 300mil
19.35 ± 0.5
16
9
1
8
2.54 ± 0.254
1.016
0° to 10°
0.457 ± 0.076
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-191
DIP016-P-0300-AU
MS-001-AA
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER
PACKAGE WEIGHT
1.0g
– 14 –
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