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Fabricante

CM1235

Small Footprint ESD Clamp Array for High Speed Data Line Protection

ON Semiconductor 

CM1235

Performance Information

Graphical Comparison and Test Setup

Figure 5 shows that the CM1235 (ESD protector) lowers the peak voltage and clamping voltage by 45% across a wide range

of loading conditions in comparison to a standard ESD protection device. Figure 6 also indicates that the DUP/ASIC protected

by the CM1235 dissipates less energy than a standard ESD protection device. This data was derived using the test setups shown

in Figure 7.

1.2

STD ESD Device

1.0

0.8

CM1235

0.6

0.4

0.2

0.5

0.4

STD ESD Device

0.3

CM1235

0.2

0.1

0

5

10

20

RDUP (W)

Figure 5. Normalized VPeak (8 KV IEC−61000

4−2 ESD Contract Strike) vs. Loading (RDUP)*

0

5

10

20

RDUP (W)

Figure 6. Normalized Residual Current into

DUP vs. RDUP*

*RDUP is the emulated Dynamic Resistance (load) of the Device Under Protection (DUP).

IEC 61000−4−2

Test Standards

Standard

ESD Device

Standard ESD

Device Test Setup

Voltage

Probe

Device Under

Protection (DUP)

RVARIABLE

Current

Probe

IRESIDUAL

IEC 61000−4−2

Test Standards

CM1235

CM1235 Test Setup

Voltage

Probe

Device Under

Protection (DUP)

RVARIABLE

Current

Probe

IRESIDUAL

Figure 7. Test Setups: Standard Device (Left) and CM1235 (Right)

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