BC847M Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
BC847M Datasheet PDF : 10 Pages
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Philips Semiconductors
NPN general purpose transistors
PACKAGE OUTLINE
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
L
2
b
e
1
L1
3 b1
e1
Product specification
BC847M series
SOT883
A
A1
E
D
0
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
A1
max.
b
b1
D
E
e
e1
L
L1
mm
0.50
0.46
0.03
0.20
0.12
0.55
0.47
0.62
0.55
1.02
0.95
0.35
0.65
0.30
0.22
0.30
0.22
Note
1. Including plating thickness
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT883
SC-101
2004 Mar 10
8
0.5
scale
1 mm
EUROPEAN
PROJECTION
ISSUE DATE
03-02-05
03-04-03
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