BAP63LX(2007) Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Fabricante
BAP63LX Datasheet PDF : 8 Pages
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NXP Semiconductors
8. Package outline
Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm
L1 (2×)
(2 ×)
wM A
1
2 b (2×)
(2 ×)
wM B
e1
BAP63LX
Silicon PIN diode
SOD882T
y
E
A
A1
A
D
(1)
B
0
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
b
D
E
e1
L1
w
y
mm
0.40
0.36
0.04
0.55
0.45
0.65
0.55
1.05
0.95
0.65
0.30
0.22
0.1
0.03
Note
1. The marking bar indicates the cathode
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOD882T
Fig 5. Package outline SOD882T
BAP63LX_1
Product data sheet
Rev. 01 — 11 December 2007
0.5
scale
1 mm
EUROPEAN
PROJECTION
ISSUE DATE
04-12-14
06-04-12
© NXP B.V. 2007. All rights reserved.
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