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BA4510FVT-TR Datasheet PDF : 22 Pages
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BA4510xxx
Datasheet
●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 29. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd ℃/W
・・・・・ (Ⅰ)
Derating curve in Figure 29. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate
at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 30. (c)
show a derating curve for an example of BA4510.
PowerLSdIisのs消ipa費ti電on力of[WL]SI [W]
θja=(Tjmax-Ta)/Pd ℃/W
Ambie周nt囲te温m度perTaatu[℃re] Ta [℃]
Pd (max)
P2
θja2 < θja1
θ' ja2
P1
θ ja2
Chip surface temperature Tj [℃]
チップ 表面温度 Tj [℃]
Power dissipation P [W]
消費電力 P [W]
(a) Thermal resistance
θ' ja1 θ ja1
Tj ' (max) Tj (max)
0
25
50
75
100 125 150
Ambient周te囲m温pe度ratTuare[℃T]a [℃]
(b) Derating curve
Figure 29. Thermal resistance and derating curve
800
600
620mW(*9)
550mW(*10)
500mW(*11)
400
470mW(*12)
BA4510F
BA4510FV
BA4510FV
200
BA4510FVM
0
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
(c)BA4510 Derating curve
(*9)
(*10)
(*11)
(*12)
Unit
6.2
5.5
5.0
4.8
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 30. Derating curve
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TSZ02201-0RAR1G200080-1-2
7.NOV.2012 Rev.001
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