ATA6624 Ver la hoja de datos (PDF) - Atmel Corporation
Número de pieza
componentes Descripción
Fabricante
ATA6624 Datasheet PDF : 31 Pages
| |||
ATA6622/ATA6624/ATA6626
7. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Min.
Typ.
Max.
Unit
Supply voltage VS
VS
Pulse time ≤ 500 ms; Ta = 25°C
Output current IVCC ≤ 50 mA
VS
Pulse time ≤ 2 min; Ta = 25°C
Output current IVCC ≤ 50 mA
VS
WAKE (with 33 kΩ serial resistor)
KL_15 (with 50 kΩ/100 nF)
DC voltage
Transient voltage due to ISO7637 (coupling 1 nF)
–0.3
–1
–150
+40
V
+40
V
27
V
+40
V
+100
V
INH
- DC voltage
LIN
- DC voltage
–0.3
VS + 0.3
V
–27
+40
V
Logic pins (RxD, TxD, EN, NRES, NTRIG,
WD_OSC, MODE, TM)
–0.3
+5.5
V
Output current NRES
PVCC DC voltage
VCC DC voltage
INRES
–0.3
–0.3
+2
mA
+5.5
V
+6.5
V
ESD according to IBEE LIN EMC
Test Spec. 1.0 following IEC 61000-4-2
- Pin VS, LIN to GND
±6
KV
- Pin WAKE (33 kΩ serial resistor) to GND
±5
KV
ESD HBM following STM5.1 with 1.5 kΩ 100 pF
- Pin VS, LIN, WAKE to GND
±6
KV
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
±3
KV
CDM ESD STM 5.3.1
±750
V
Machine Model ESD AEC-Q100-RevF(003)
±200
V
Junction temperature
Storage temperature
Tj
–40
Ts
–55
+150
°C
+150
°C
8. Thermal Characteristics
Parameters
Symbol
Min.
Typ.
Max.
Unit
Thermal resistance junction to heat slug
Rthjc
Thermal resistance junction to ambient, where
heat slug is soldered to PCB
Rthja
10
K/W
35
K/W
Thermal shutdown of VCC regulator
150
165
170
°C
Thermal shutdown of LIN output
150
165
170
°C
Thermal shutdown hysteresis
10
°C
17
4986I–AUTO–07/10
Share Link: 