Packaging Information
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
.045(1.14) X 45° PIN NO. 1
IDENTIFY
.025(.635) X 30° - 45°
.012(.305)
.008(.203)
.032(.813)
.026(.660)
.553(14.0)
.547(13.9)
.595(15.1)
.585(14.9)
.530(13.5)
.490(12.4)
.021(.533)
.013(.330)
.050(1.27) TYP
.300(7.62) REF
.430(10.9)
.390(9.90)
AT CONTACT
POINTS
.030(.762)
.015(3.81)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.453(11.5)
.447(11.4)
.495(12.6)
.485(12.3)
.022(.559) X 45° MAX (3X)
32T, 32-Lead, Plastic Thin Small Outline
Package (TSOP)
Dimensions in Millimeters and (Inches)*
32P6, 32-Lead, 0.600" Wide,
Plastic Dual In-line Package (PDIP)
Dimensions in Inches and (Millimeters)
1.67(42.4)
1.64(41.7)
PIN
1
.566(14.4)
.530(13.5)
.220(5.59)
MAX
SEATING
PLANE
.161(4.09)
.125(3.18)
.110(2.79)
.090(2.29)
.012(.305)
.008(.203)
1.500(38.10) REF
.090(2.29)
MAX
.005(.127)
MIN
.065(1.65)
.041(1.04)
.065(1.65)
.015(.381)
.022(.559)
.014(.356)
.630(16.0)
.590(15.0)
0 REF
15
.690(17.5)
.610(15.5)
32V, 32-Lead, Plastic Thin Small Outline
Package (VSOP)
Dimensions in Millimeters and (Inches)
INDEX
MARK
18.5(.728) 20.2(.795)
18.3(.720) 19.8(.780)
INDEX
MARK
12.5(.492) 14.2(.559)
12.3(.484) 13.8(.543)
0.50(.020)
BSC
7.50(.295)
REF
8.20(.323)
7.80(.307)
0.25(.010)
0.15(.006)
1.20(.047) MAX
0
5
REF
0.15(.006)
0.05(.002)
0.70(.028)
0.50(.020)
*Controlling dimension: millimeters
0.20(.008)
0.10(.004)
20 AT49BV/LV002(N)(T)
0.50(.020)
BSC
7.50(.295)
REF
8.10(.319)
7.90(.311)
0.25(.010)
0.15(.006)
1.20(.047) MAX
0
5
REF
0.15(.006)
0.05(.002)
0.70(.028)
0.50(.020)
0.20(.008)
0.10(.004)