AT24C32D-MEHM-B Ver la hoja de datos (PDF) - Atmel Corporation

Número de pieza

componentes Descripción

Fabricante

AT24C32D-MEHM-B

I2C-Compatible (2-Wire) Serial EEPROM 32-Kbit (4,096 x 8)

Atmel Corporation 

12. Ordering Information

Atmel Ordering Code

AT24C32D-SSHM-B

AT24C32D-SSHM-T

Lead Finish

Package

Delivery Information

Form

Quantity

Bulk (Tubes) 100 per Tube

8S1

Tape and Reel 4,000 per Reel

Operating

Range

AT24C32D-XHM-B

AT24C32D-XHM-T

AT24C32D-MAHM-T

AT24C32D-MAHM-E

AT24C32D-MEHM-T

AT24C32D-STUM-T

AT24C32D-UUM-T(1)

AT24C32D-CUM-T

NiPdAu

(Lead-free/Halogen-free)

Matte Tin

(Lead-free/Halogen-free)

SnAgCu

(Lead-free/Halogen-free)

8X

8MA2

8ME1

5TS1

5U-3

8U2-1

Bulk (Tubes) 100 per Tube

Tape and Reel 5,000 per Reel

Tape and Reel 5,000 per Reel

Tape and Reel

15,000 per Reel

Industrial

Temperature

(-40°C to 85°C)

Tape and Reel 5,000 per Reel

Tape and Reel 5,000 per Reel

Tape and Reel 5,000 per Reel

Tape and Reel 5,000 per Reel

AT24C32D-WWU11M(2)

N/A

Wafer Sale

Note 2

Notes: 1. WLCSP Package: CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM

cells. Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light

does not occur.

2. Contact Atmel Sales for Wafer sales.

8S1

8X

8MA2

8ME1

5TS1

5U-3

8U2-1

Package Type

8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Dual No Lead (UDFN)

8-pad, 1.80mm x 2.20mm body, 0.40mm pitch, Extra Thin DFN (XDFN)

5-lead, 2.90mm x 1.60mm Plastic Think Shrink Small Outline (SOT23)

5-ball, 3x3 Grid Array, Wafer Level Chip Scale Package (WLCSP)

8-ball, Die Ball Grid Array (VFBGA)

AT24C32D [DATASHEET]

15

Atmel-8866D-SEEPROM-AT24C32D-Datasheet_122016

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