APC18T12 Ver la hoja de datos (PDF) - Astec Semiconductor => Silicon Link
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APC18T12 Datasheet PDF : 10 Pages
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Technical Reference Notes
APC18T12 Series
RECOMMENDED LOCATION FOR PICK AND PLACE
The flat top surface of the large inductor (topside of the board) provides a versatile and convenient way of picking up the
module (see Figure 10). A 6-7mm outside diameter nozzle from a conventional SMD machine is recommended to attain
maximum vacuum pick-up. Nozzle travel and rotation speed should be controlled to prevent this off-centered picked-up
module from falling off the nozzle. The use of vision recognition systems for placement accuracy will be very helpful.
REFLOW NOTES / RECOMMENDATIONS
1. Refer to the recommended Reflow Profile per
Figure 11. Profile parameters exceeding the
recommended maximums may result to
permanent damage to the module.
2. The module is recommended for topside
reflow process to the host card. For other
orientations, contact factory.
3. In the event that the module needs to be
desoldered from the host card, some pins
may be detached from the module.
240
220
200
180
160
140
120
100
80
60
40
20
0
0
RECOMMENDED REFLOW PROFILE
183°C
PEAK TEMPERATURE
200°C - 230°C
110°C
PRE-HEAT ZONE
120 - 180 sec
SLOPE
< 4°C /sec
REFLOW
ZONE
< 80 sec
30 60 90 120 150 180 210 240 270 300
TIME (seconds)
Figure 10. Recommended Reflow profile.
PICK-UP LOCATION
Figure 11. Recommended Pick-up location.
MODEL: APC18T12 SERIES
NOVEMBER 4, 2004 - REVISION 00
SHEET 9 OF 10
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