APA2176OI-TRG Ver la hoja de datos (PDF) - Anpec Electronics
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APA2176OI-TRG Datasheet PDF : 28 Pages
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APA2176/2176A
Application Information (Cont.)
Thermal Consideration (Cont.)
first consideration to calculate maximum ambient tem-
peratures is the numbers from the Power Dissipation vs.
Output Power graphs are per channel values, therefore,
the dissipation of the IC heat needs to be doubled for
two-channel operation. Given θJA, the maximum allow-
able junction temperature (T ), the total internal dissi-
JMax
pation (PD), and the maximum ambient temperature can
be calculated with the following equation. The maximum
recommended junction temperature for the APA2176/
2176A is 150°C. The internal dissipation figures are taken
from the Power Dissipation vs. Output Power graphs.
The APA2176/2176A is designed with a thermal shutdown
protection that turns the device off when the junction tem-
perature surpasses 150°C to prevent damaging the IC.
Layout Consideration
1. All components should be placed close to the APA2176/
2176A. For example, the input capacitor (C ) should be
i
close to APA2176/2176A’s input pins to avoid causing
noise coupling to APA2176/2176A’s high impedance
inputs; the decoupling capacitor (C ) should be placed
S
by the APA2176/2176A’s power pin to decouple the
power rail noise.
2. The output traces should be short, wide (>50mil), and
symmetric.
3. The input trace should be short and symmetric.
4. The power trace width should be greater than 50mil.
5. The TQFN Thermal PAD should be soldered on PCB,
and the ground plane needs soldered mask (to avoid
short circuit) except the Thermal PAD area.
0.8mm
0.35mm
ThermalVia
Diameter
0.3mm X 5
0.5mm
2.2mm
Ground
Plane for
ThermalPAD
Figure 2. TQFN4x4-20B Layout Recommendation
0.3mm
1mm
Thermal Via
Diameter
0.3mm X 5
0.5mm
1.55mm
Ground
Plane for
Thermal
PAD
Figure 3. TQFN3x3-16 Layout Recommendation
Copyright © ANPEC Electronics Corp.
20
Rev. A.7 - Jan., 2013
www.anpec.com.tw
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