APA2175
Application Information (Cont.)
Layout Consideration (Cont.)
1. All components should be placed close to the APA2175.
For example, the input capacitor (Ci) should be close to
APA2175’s input pins to avoid causing noise coupling
to APA2175’s high impedance inputs; the decoupling
capacitor (C ) should be placed by the APA2175’s power
S
pin to decouple the power rail noise.
2. The output traces should be short and wide (>20mil).
3. The input trace should be short and symmetric.
4. The power trace width should be greater than 20mil.
5. The TQFN Thermal PAD should be soldered on PCB,
and the ground plane needs soldered mask (to avoid
short circuit) except the Thermal PAD area.
Copyright © ANPEC Electronics Corp.
13
Rev. A.3 - Jul., 2010
www.anpec.com.tw