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APA2174 Ver la hoja de datos (PDF) - Anpec Electronics

Número de pieza
componentes Descripción
Fabricante
APA2174
Anpec
Anpec Electronics Anpec
APA2174 Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
APA2174
Application Information (Cont.)
Input Resistor, Ri (Cont.)
Gain(A V
)
=
Rf
Ri
(6)
The external gain setting is recommended using from
-1V/V
to
-10V/V,
and
the
R
i
is
in
the
range
from
1k
to
47k. It’s recommended to use 1% tolerance resistor or
better. Keep the input trace as short as possible to limit
the noise injection. The gain is recommended to set
-1V/V, and Ri is 10k, and Rf is 10k.
Feedback Resistor, Rf
Refer the figure 3, the external gain is setting by R and R ;
i
f
and the gain setting is recommended using from -1V/V to
-10V/V. The Rf is in the range from 4.7kto 100k. It’s
recommended to use 1% tolerance resistor or better.
Power Supply Decoupling, Cs
The APA2174 is a high-performance CMOS audio ampli-
fier that requires adequate power supply decoupling to
ensure the output total harmonic distortion (THD+N) is
as low as possible. Power supply decoupling also pre-
vents the oscillations being caused by long lead length
between the amplifier and the speaker.
The optimum decoupling is achieved by using two differ-
ent types of capacitors that target on different types of
noise on the power supply leads. For higher frequency
transients, spikes, or digital hash on the line, a good low
equivalent-series- resistance (ESR) ceramic capacitor,
typically 0.1µF, is placed as close as possible to the de-
vice VDD and PVDD lead for the best performance. For
filtering lower frequency noise signals, a large alumi-
num electrolytic capacitor of 10µF or greater placed near
the audio power amplifier is recommended.
Charge Pump Bypass Capacitor, C
CPB
The bypass capacitor (CCPB) relates with the charge
pump switching transient. The capacitor’s value is same
as flying capacitor (2.2µF). Place it close to the PVDD and
PGND.
Charge Pump Flying Capacitor, CCPF
The flying capacitor affects the load transient of the charge
pump. If the capacitor’s value is too small, then that will
degrade the charge pump’s current driver capability and
the performance of line drive amplifier.
Increasing the flying capacitor’s value will improve the
load transient of charge pump. It is recommended using
the low ESR ceramic capacitors (X7R type is
recommended) above 2.2µF.
Charge Pump Output Capacitor, CCPO
The output capacitor’s value affects the power ripple di-
rectly at CV (V ). Increasing the value of output capaci-
SS SS
tor reduces the power ripple. The ESR of output capacitor
affects the load transient of CVSS (VSS). Lower ESR and
greater than 2.2µF ceramic capacitor is a recommendation.
Layout Consideration
0.9mm
0.35mm
ThermalVia
Diameter
0.3mm X 5
0.5mm
2.2mm
Ground
Plane for
ThermalPAD
Figure 2: TQFN4x4-20B Land Pattern Recommendation
1. All components should be placed close to the APA2174.
For example, the input capacitor (C ) should be close to
i
APA2174’s input pins to avoid causing noise coupling
to APA2174’s high impedance inputs; the decoupling
capacitor (CS) should be placed by the APA2174’s power
pin to decouple the power rail noise.
2. The output traces should be short and wide (>20mil),
3. The input trace should be short and symmetric.
4. The power trace width should be greater than 20mil.
5. The TQFN Thermal PAD should be soldered on PCB,
and the ground plane needs soldered mask (to avoid
short circuit) except the Thermal PAD area.
Copyright © ANPEC Electronics Corp.
13
Rev. A.6 - Dec., 2011
www.anpec.com.tw

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