AP2162(2009) Ver la hoja de datos (PDF) - Diodes Incorporated.

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componentes Descripción

Fabricante

AP2162
(Rev.:2009)

1A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH

Diodes Incorporated. 

Electrical Characteristics

AP2162/AP2172

1A DUAL CHANNEL CURRENT-LIMITED POWER

SWITCH

(TA = 25oC, VIN = +5.0V, unless otherwise stated)

Symbol

Parameter

Test Conditions

VUVLO

ISHDN

IQ

ILEAK

Input UVLO

Rload=1kΩ

Input Shutdown Current

Disabled, IOUT= 0

Input Quiescent Current, Dual Enabled, IOUT= 0

Input Leakage Current

Disabled, OUT grounded

IREV

RDS(ON)

ISHORT

ILIMIT

ITrig

VIL

VIH

ISINK

TD(ON)

TR

TD(OFF)

TF

RFLG

TBlank

TSHDN

THYS

Reverse Leakage Current

Disabled, VIN = 0V, VOUT = 5V, IREV at VIN

Switch on-resistance

VIN = 5V, IOUT= 0.5A, MSOP-8L-EP

-40oC≤ TA ≤85oC

SOP-8L

VIN = 3.3V, IOUT= 0.5A, -40oC≤ TA ≤85oC

Short-circuit current limit

Over-Load Current Limit

Enabled into short circuit, CL=68μF

VIN = 5V, VOUT = 4.6V, CL=68μF, -40oC≤

TA ≤85oC

Current limiting trigger

VIN = VEN, Output Current Slew rate

threshold

(<100A/s), CL=68μF

EN Input Logic Low Voltage VIN = 2.7V to 5.5V

EN Input Logic High Voltage VIN = 2.7V to 5.5V

EN Input leakage

VEN = 5V

Output turn-on delay time

CL=1μF, Rload=10Ω

Output turn-on rise time

CL=1μF, Rload=10Ω

Output turn-off delay time

CL=1μF, Rload=10Ω

Output turn-off fall time

CL=1μF, Rload=10Ω

FLG output FET on-resistance IFLG =10mA

FLG blanking time

CIN=10μF, CL=68μF

Thermal shutdown threshold Enabled, Rload=1kΩ

Thermal shutdown hysteresis

θJA

Thermal Resistance

Junction-to-Ambient

SOP-8L (Note 4)

MSOP-8L-EP (Note 5)

Min Typ. Max Unit

1.6 1.9 2.5 V

0.5 1 μA

100 160 μA

1 μA

1

μA

115 150 mΩ

120 160 mΩ

140 180 mΩ

1.4

A

1.1 1.5 1.9 A

2.4

A

0.8 V

2

V

1 μA

0.05

ms

0.6 1.5 ms

0.01

ms

0.05 0.1 ms

30 50 Ω

4 7 15 ms

140

°C

25

°C

110

oC/W

60

oC/W

Notes:

4. Test condition for SOP-8L: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.

5. Test condition for MSOP-8L-EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3

vias to bottom layer ground plane.

AP2162/AP2172 Rev. 5

5 of 17

www.diodes.com

FEBRUARY 2009

© Diodes Incorporated

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