AMD-X5-133 Ver la hoja de datos (PDF) - Advanced Micro Devices
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AMD-X5-133 Datasheet PDF : 67 Pages
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PRELIMINARY
AMD
12 PACKAGE THERMAL
SPECIFICATIONS
The Am5X86 microprocessor is specified for operation
when TCASE (the case temperature) is within the range
of 0°C to +55°C or +85°C. TCASE can be measured in
any environment to determine whether the Am5X86 mi-
croprocessor is within specified operating range. The
case temperature should be measured at the center of
the top surface opposite the pins.
The ambient temperature (TA) is guaranteed if TCASE is
not violated. The ambient temperature can be calculated
from θJC and θJA and from the following equations:
TJ = TCASE + (P • θJC)
TA = TJ – (P • θJA)
TCASE = TA + (P • [θJA – θJC])
Where:
TJ, TA, TCASE
θJC, θJA
P
= Junction, Ambient, and Case Temperature
= Junction-to-Case and Junction-to-Ambient
Thermal Resistance, respectively
= Maximum Power Consumption
The values for θJA and θJC are given in Table 21 for the
1.75 sq. in., 168-pin, ceramic PGA. For the 208-pin
SQFP plastic package, θJA = 14.0 and θJC = 1.5.
Table 22 shows the TA allowable (without exceeding
TCASE) at various airflows and TCASE values for the PGA
package. Note that TA is greatly improved by attaching
a heat sink to the package. P (the maximum power con-
sumption) is calculated by using a maximum ICC value
of 931 mA at 3.3 V. Table 23 shows the TA allowable
(without exceeding TCASE) for the SQFP package using
a maximum ICC value of 931 mA at 3.3 V.
Table 21. Thermal Resistance (°C/W) θJC and θJA for the Am5X86 CPU in 168-Pin PGA Package
Cooling
Mechanism
θJC
θJA vs. Airflow-Linear ft/min. (m/s)
0
200
400
(0)
(1.01)
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
No Heat Sink
1.5
16.5
14.0
12.0
10.5
9.5
9.0
Heat Sink*
2.0
12.0
7.0
5.0
4.0
3.5
3.25
Heat Sink* and fan 2.0
5.0
4.6
4.2
3.8
3.5
3.25
Note:
*0.350″ high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing)
TA by Cooling Type
TA without Heat Sink
TA with Heat Sink
TA with Heat Sink and fan
TA without Heat Sink
TA with Heat Sink
TA with Heat Sink and fan
Table 22. Maximum TA at Various Airflows in °C
Airflow-Linear ft/min. (m/sec)
TCASE
Clock
0
200
400
600
(0)
(1.01) (2.03) (3.04)
55°C
55°C
55°C
133 MHz
133 MHz
133 MHz
8.9°C
24.3°C
45.8°C
16.6°C
39.6°C
47.0°C
22.7°C
45.8°C
48.2°C
27.3°C
48.9°C
49.5°C
85°C
85°C
85°C
133 MHz
133 MHz
133 MHz
38.9°C
54.3°C
75.8°C
46.6°C
69.6°C
77.0°C
52.7°C
75.8°C
78.2°C
57.3°C
78.9°C
79.5°C
800
(4.06)
30.4°C
50.4°C
50.4°C
60.4°C
80.4°C
80.4°C
1000
(5.07)
32.0°C
51.2°C
51.2°C
62.0°C
81.2°C
81.2°C
Table 23. Maximum TA for SQFP Package by Clock Frequency
TCASE
85°C
Clock
133 MHz
TA
46.6°C
Am5X86 Microprocessor
65
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