HT9302X Ver la hoja de datos (PDF) - Holtek Semiconductor
Número de pieza
componentes Descripción
Fabricante
HT9302X Datasheet PDF : 33 Pages
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18-pin DIP (300mil) Outline Dimensions
A
18
10
B
1
9
H
C
D
E
G
I
F
Fig1. Full Lead Packages
· MS-001d (see fig1)
Symbol
A
B
C
D
E
F
G
H
I
· MS-001d (see fig1)
Symbol
A
B
C
D
E
F
G
H
I
Min.
880
240
115
115
14
45
¾
300
¾
Min.
845
240
115
115
14
45
¾
300
¾
HT9302 Series
A
18
10
B
1
9
H
C
D
E
G
I
F
Fig2. 1/2 Lead Packages
Dimensions in mil
Nom.
¾
¾
¾
¾
¾
¾
100
¾
¾
Dimensions in mil
Nom.
¾
¾
¾
¾
¾
¾
100
¾
¾
Max.
920
280
195
150
22
70
¾
325
430
Max.
880
280
195
150
22
70
¾
325
430
Rev. 1.30
25
May 13, 2009
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