ADG758 Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
componentes Descripción
Fabricante
ADG758 Datasheet PDF : 12 Pages
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ADG758/ADG759
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
16
15
20
1
EXPOSED
PAD
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
11
5
0.65
10
6
0.20 MIN
0.60
BOTTOM VIEW
0.55
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATIONS
SECTION OF THIS DATA SHEET.
0.20 REF
ORDERING GUIDE
Model1
ADG758BCPZ
ADG758BCPZ-REEL7
ADG759BCPZ
ADG759BCPZ-REEL
ADG759BCPZ-REEL7
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)
1 Z = RoHS Compliant Part.
REVISION HISTORY
3/13—Rev. A to Rev. B
Updated Outline Dimensions........................................................12
Changes to Ordering Guide...........................................................12
5/02—Rev. 0 to Rev. A
Edits to General Description section..............................................1
Updated Outline Drawings ............................................................12
Package Option
CP-20-6
CP-20-6
CP-20-6
CP-20-6
CP-20-6
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02371-0-3/13(B)
Rev. B | Page 12
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