ADCMP567 Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
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Fabricante
ADCMP567 Datasheet PDF : 14 Pages
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ADCMP567
Data Sheet
OUTLINE DIMENSIONS
5.00
BSC SQ
PIN 1
INDICATOR
0.60 MAX
4.75
BSC SQ
0.50
BSC
TOP VIEW
1.00 12° MAX
0.85
0.80
0.80 MAX
0.65 TYP
SEATING
0.30
PLANE
0.25
0.18
0.50
0.40
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.20 REF 0.08
0.60 MAX
25
32
24
1
EXPOSED
PAD
17
8
16
9
BOTTOM VIEW
3.50 REF
PIN 1
INDICATOR
2.85
2.70 SQ
2.55
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 23. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
ADCMP567BCPZ −40°C to +85°C
1 Z = RoHS Compliant Part
Package Description
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Package Option
CP-32-8
©2003–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03632-0-1/15(A)
Rev. A | Page 14 of 14
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