MXED102 Ver la hoja de datos (PDF) - Clare Inc => IXYS
Número de pieza
componentes Descripción
Fabricante
MXED102 Datasheet PDF : 20 Pages
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MXED102
Preliminary
BONDING PADS
Locations and Sizes - Driver Outputs
The information contained on this page is preliminary. Although the order of the bond pad will remain the same, the XY dimensions in the final
document may vary slightly. Please take this possibility into consideration when doing any chip on board layouts.
16
www.clare.com
Rev. 2
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