DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

AAT3685IWP-4.2-1-T1 Ver la hoja de datos (PDF) - Analog Technology Inc

Número de pieza
componentes Descripción
Fabricante
AAT3685IWP-4.2-1-T1
Analog-Technology
Analog Technology Inc Analog-Technology
AAT3685IWP-4.2-1-T1 Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
BatteryManagerTM
Timing Diagram
PRODUCT DATASHEET
AAT3685
Lithium-Ion/Polymer Battery Charger
SQ
CK
Data
SQPULSE
System Reset
System Start
TSYNC
TLAT
TDATA(RPT) = TSYNC + TLAT < 2.5 PDATA
TOFF > 2 PDATA
PDATA
N=1
N=2
TOFF
N=3
Thermal Considerations
The AAT3685 is packaged in a Pb-free, 3x3mm TDFN
package which can provide up to 2.0W of power dissipa-
tion when it is properly bonded to a printed circuit board
and has a maximum thermal resistance of 50°C/W.
Many considerations should be taken into account when
designing the printed circuit board layout, as well as the
placement of the charger IC package in proximity to
other heat generating devices in a given application
design. The ambient temperature around the charger IC
will also have an affect on the thermal limits of a battery
charging application. The maximum limits that can be
expected for a given ambient condition can be estimated
by the following discussion.
First, the maximum power dissipation for a given situa-
tion should be calculated:
Eq. 4: PD = [(VIN - VBAT) · ICC + (VIN · IOP)]
Where:
PD = Total Power Dissipation by the Device
VIN = Input Voltage Level, VADP/USB
VBAT = Battery Voltage as Seen at the BAT Pin
ICC = Maximum Constant Fast Charge Current
Programmed for the Application
IOP = Quiescent Current Consumed by the Charger IC
for Normal Operation
Next, the maximum operating ambient temperature for
a given application can be estimated based on the ther-
mal resistance of the 3x3mm TDFN package when suf-
ficiently mounted to a PCB layout and the internal ther-
mal loop temperature threshold.
Eq. 5: TA = TJ - (θJA · PD)
Where:
TA = Ambient Temperature in Degrees C
TJ = Maximum Device Junction Temperature Protected
by the Thermal Limit Control
PD = Total Power Dissipation by the Device
θJA = Package Thermal Resistance in °C/W
Example:
For an application where the fast charge current is set to
500mA, VUSB = 5.0V and the worst case battery voltage
at 3.0V, what is the maximum ambient temperature at
which the thermal limiting will become active?
Given:
VUSB = 5.0V
VBAT = 3.0V
ICC = 500mA
IOP = 0.75mA
TJ = 140°C
θJA = 50°C/W
Using Equation 4, calculate the device power dissipation
for the stated condition:
Eq. 6: PD = (5.0V - 3.0V)(500mA) + (5.0V · 0.75mA)
= 1.00375W
3685.2007.12.1.4
www.analogictech.com
17

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]