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74LVC1G06FX4 Datasheet PDF : 16 Pages
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74LVC1G06
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
θJA
θJC
Parameter
Thermal Resistance
Junction-to-Ambient
Thermal Resistance
Junction-to-Case
Test Conditions
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
VCC
(Note 10)
(Note 10)
Min
Typ.
Max
Unit
—
204
—
—
371
—
—
231
—
—
400
—
°C/W
—
435
—
—
445
—
—
470
—
—
460
—
—
52
—
—
143
—
—
105
—
—
225
—
°C/W
—
250
—
—
250
—
—
275
—
—
265
—
Note:
10. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
Switching Characteristics
Figure 1 Typical Values at TA = +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V.
Parameter
From
Input
To
Output
VCC
TA = -40°C to +85°C
Min
Typ
Max
1.8V ± 0.15V
1.0
3.0
6.5
2.5V ± 0.2V
0.5
1.9
4.0
tpd
A or B
Y
2.7V
0.5
2.5
4.5
3.3 V ± 0.3V
0.5
2.3
4.0
5.0V ± 0.5V
0.5
1.7
3.0
TA = -40°C to +125°C
Unit
Min
Max
1.0
8.5
0.5
5.5
0.5
6.0
ns
0.5
5.5
0.5
4.0
Operating Characteristics
TA = +25°C
Cpd
Parameter
Power Dissipation
Capacitance
Test
Conditions
f = 10MHz
VCC = 1.8V
Typ
3
VCC = 2.5V
Typ
3
VCC = 3.3V
Typ
4
VCC = 5V
Typ
6
Unit
pF
74LVC1G06
Document number: DS32272 Rev. 11 - 2
5 of 16
www.diodes.com
April 2018
© Diodes Incorporated
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