MCP6001T-E/LO Ver la hoja de datos (PDF) - Microchip Technology
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MCP6001T-E/LO Datasheet PDF : 24 Pages
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8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
MCP6001/2/4
E
E1
p
B
n
D
2
1
α
c
(F)
β
A
A2
φ
A1
L
Units
INCHES
MILLIMETERS*
Number of Pins
Pitch
Dimension Limits
n
p
MIN
NOM
MAX
8
.026 BSC
MIN
NOM
8
0.65 BSC
Overall Height
A
-
-
.043
-
-
Molded Package Thickness
A2
.030
.033
.037
0.75
0.85
Standoff
A1
.000
-
.006
0.00
-
Overall Width
E
.193 TYP.
4.90 BSC
Molded Package Width
E1
.118 BSC
3.00 BSC
Overall Length
D
.118 BSC
3.00 BSC
Foot Length
L
.016
.024
.031
0.40
0.60
Footprint (Reference)
Foot Angle
Lead Thickness
F
.037 REF
0.95 REF
φ
0°
-
8°
0°
-
c
.003
.006
.009
0.08
-
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.009
.012
.016
0.22
-
α
5°
-
15°
5°
-
β
5°
-
15°
5°
-
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
2003 Microchip Technology Inc.
DS21733D-page 17
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