33389 Ver la hoja de datos (PDF) - Freescale Semiconductor

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componentes Descripción

Fabricante

33389

System Basis Chip with Low Speed Fault Tolerant CAN

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

THERMAL RESISTANCE

RTH, RTL Termination Resistance

Junction to Heatsink Thermal Resistance for HSOP-20

33% Power on V1, 66% on V2 (including CAN) (2)

RRTHRTL

RAJC

500 to 16 k

3.1

Ω

°C/W

Junction to Pin Thermal Resistance for SO-28WD (3)

Thermal Shutdown Temperature

Peak Package Reflow Temperature During Reflow (4), (5)

RAS/P

TSD

TPPRT

17

165

Note 5

°C/W

°C

°C

Notes

2. Refer to thermal management in device description section.

3. Refer to thermal management in device section. Ground pins 6, 7, 8, 9, 20, 21, 22, and 23 of SO28WB package.

4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

33389

7

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