EOL Data Sheet
PACKAGING DIAGRAMS
Pin # 1 Identifier
2 Mbit Flash + 1 Mbit SRAM ComboMemory
SST31LF021 / SST31LF021E
1.05
0.95
0.50
BSC
8.10
0.27
7.90
0.17
12.50
12.30
0.70
0.50
14.20
13.80
1.20
max.
0.15
0.05
DETAIL
Note:
0.70
0.50
1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
1mm
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
0˚- 5˚
32-tsop-WH-7
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
TABLE 13: REVISION HISTORY
Number
03 • 2002 Data Book
Description
04 • Corrected the Test Conditions for IDD in Table 5 on page 9
• Added Revision History
05 • 2004 Data Book
06 • End-of-Life data sheet for all valid combination in S71137
Date
Feb 2002
Aug 2003
Dec 2003
May 2007
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036
www.SuperFlash.com or www.sst.com
©2007 Silicon Storage Technology, Inc.
24
S71137-06-EOL
05/07