MT28F160A3 Ver la hoja de datos (PDF) - Micron Technology

Número de pieza

componentes Descripción

Fabricante

MT28F160A3

1 MEG x 16 ENHANCED BOOT BLOCK FLASH MEMORY

Micron Technology 

.80 ±.075

ADVANCE

1 MEG x 16

ENHANCED BOOT BLOCK FLASH MEMORY

46-BALL FBGA

.10 A

A

Ø

.35

+.05

-.10

(TYP)

3.50 ±.05

7.00 ±.10

1.875 ±.05

5.25

.75

(TYP)

PIN #1 ID

.75 (TYP)

3.75

SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb

SOLDER BALL PAD: Ø .27mm

SUBSTRATE: PLASTIC LAMINATE

MOLD COMPOUND: EPOXY NOVOLAC

PIN #1 ID

2.625 ±.05 4.00 ±.05

8.00 ±.10

1.20 MAX

NOTE: 1. All dimensions in millimeters MAX or typical where noted.

MIN

2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.

DATA SHEET DESIGNATION

Advance: This data sheet contains initial descriptions of products still under development.

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992

Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.

1 Meg x 16 Enhanced Boot Block Flash Memory

MT28F160A3_3.p65 – Rev. 3, Pub. 8/01

27

Micron Technology, Inc., reserves the right to change products or specifications without notice.

©2001, Micron Technology, Inc.

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