M24SR Ver la hoja de datos (PDF) - STMicroelectronics

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componentes Descripción

Fabricante

M24SR

Dynamic NFC/RFID tag IC with 2-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface

STMicroelectronics 

Package information

M24SR02-Y

15.3

UFDFPN8 package information

Figure 23. UFDFPN8 - 8-lead, 2 x 3 mm, 0.5 mm pitch ultra thin profile fine pitch

dual flat package outline

'

1

3LQ

,'PDUNLQJ

$%

(

[

DDD &  

7RSYLHZ

[ DDD &

$

FFF 

$

HHH &

6HDWLQJSODQH

6LGHYLHZ

&

$

'

H



/

E

/

/ /

'DWXP$

3LQ

,'PDUNLQJ

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.

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H

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=:EB0(B9

1. Max package warpage is 0.05 mm.

2. Exposed copper is not systematic and can appear partially or totally according to the cross section.

3. Drawing is not to scale.

4.

The

(not

central pad

connected)

(the area E2 by D2 in the

in the end application.

above

illustration)

must

be

either

connected

to

VSS

or

left

floating

82/90

DocID025386 Rev 10

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