EOL Data Sheet
PACKAGING DIAGRAMS
Pin # 1 Identifier
8 Mbit Multi-Purpose Flash
SST39LF080 / SST39VF080
10.10
9.90
1.05
0.95
0.50
BSC
0.27
0.17
18.50
18.30
0.70
0.50
20.20
19.80
1.20
max.
DETAIL
Note: 1. Complies with JEDEC publication 95 MO-142 CD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
1mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
FIGURE 20: 40-lead Thin Small Outline Package (TSOP) 10mm x 20mm
SST Package Code: EI
0.15
0.05
0˚- 5˚
0.70
0.50
40-tsop-EI-7
©2007 Silicon Storage Technology, Inc.
24
S71146-07-EOL
6/07