AD5722 Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
componentes Descripción
Fabricante
AD5722 Datasheet PDF : 31 Pages
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Data Sheet
OUTLINE DIMENSIONS
AD5722/AD5732/AD5752
7.90
5.02
7.80
5.00
7.70
4.95
24
13
4.50
4.40
4.30
6.40 BSC
EXPOSED
PAD
(Pins Up)
3.25
3.20
3.15
1
12
TOP VIEW
1.05
1.20 MAX
1.00
0.80
0.15
0.05
SEATING
PLANE
0.65
BSC
0.30
0.19
0.10 COPLANARITY
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
8°
FUNCTION DESCRIPTIONS
0°
SECTION OF THIS DATA SHEET.
0.20
0.09
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-ADT
Figure 47. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Resolution (Bits)
AD5722AREZ
12
AD5722AREZ-REEL7 12
AD5732AREZ
14
AD5732AREZ-REEL7 14
AD5752AREZ
16
AD5752AREZ-REEL7 16
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
INL
±1 LSB
±1 LSB
±4 LSB
±4 LSB
±16 LSB
±16 LSB
TUE (% FSR)
±0.3
±0.3
±0.3
±0.3
±0.3
±0.3
Package Description
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
24-Lead TSSOP_EP
Package Option
RE-24
RE-24
RE-24
RE-24
RE-24
RE-24
1 Z = RoHS Compliant Part.
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D06467-0-2/17(F)
Rev. F | Page 31 of 31
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