SA58671 Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Fabricante
SA58671 Datasheet PDF : 24 Pages
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NXP Semiconductors
SA58671
1.2 W/channel stereo class-D audio amplifier
13. Package outline
WLCSP16: wafer level chip-size package; 16 bumps; 2.06 x 2.11 x 0.6 mm
SA58671UK
D
bump A1
index area
BA
E
A2
A
A1
detail X
e1
1/2 e
e
b
D
C
B
A
1234
∅v M C A B
∅w M C
e
e2
1/2 e
C
y
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
max
A1
A2
b
D
E
e
e1 e2
v
w
y
mm
0.64
0.26
0.22
0.38
0.34
0.34
0.30
2.08
2.04
2.13
2.09
0.5
1.5
1.5 0.01 0.04 0.02
OUTLINE
VERSION
IEC
SA58671UK
REFERENCES
JEDEC
JEITA
Fig 17. Package outline WLCSP16
SA58671_2
Product data sheet
Rev. 02 — 24 October 2008
EUROPEAN
PROJECTION
ISSUE DATE
07-10-11
07-10-17
© NXP B.V. 2008. All rights reserved.
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