PCF2114 Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
PCF2114 Datasheet PDF : 64 Pages
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Philips Semiconductors
LCD controller/drivers
19 BONDING PAD LOCATIONS
handbook, full pagewidth
C1
R24
R23
R22
R21
R20
R19
R18
R17
R8
R7
R6
R5
R4
R3
R2
R1
≈ 6.99
mm
DB7
SCL
DB6
SDA
DB5
V0
VLCD1
DB4
VLCD2
DB3
VLCD3
DB2
y
0
0
PCF2114
PCF2116
Chip dimensions: approximately 5.64 × 6.99 mm.
Pad area: 0.0121 mm2.
Bonding pad dimensions: 110 × 110 µm.
≈ 5.64 mm
Fig.40 Bonding pad locations.
1997 Apr 07
57
Product specification
PCF2116 family
C30
C31
C32
C33
C34
C35
C36
C37
C38
C39
C40
C41
C42
C43
C44
C45
x
C46
C47
C48
C49
C50
C51
C52
C53
C54
C55
C56
C57
C58
C59
C60
R32
MLB969
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