STA333ML13TR(2007) Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
STA333ML13TR
(Rev.:2007)
(Rev.:2007)
STMicroelectronics
STA333ML13TR Datasheet PDF : 15 Pages
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Package thermal characteristics
6
Package thermal characteristics
STA333ML
A thermal resistance of 25 °C per Watt can be achieved using a ground copper area of
3 x 3 cm, and using 16 vias, on the PCB (see Figure 7). The amount of power dissipated
within the device depends primarily on the supply voltage, load impedance and output
modulation level.
The max estimated dissipated power for the STA333ML is 3 W. This gives, with the
suggested board copper area, a maximum ∆Tj of 75 °C. This gives a safety margin before
the thermal protection intervention is invoked (Tj=150 °C) in consumer environments where
a 50 °C is the maximum ambient temperature.
Figure 7. Thermal characteristic
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