MF1S5009 Ver la hoja de datos (PDF) - NXP Semiconductors.

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componentes Descripción

Fabricante

MF1S5009

Mainstream contactless smart card IC for fast and easy solution development

NXP Semiconductors. 

NXP Semiconductors

14. Package outline

MF1S5009

Mainstream contactless smart card IC

PLLMC: plastic leadless module carrier package; 35 mm wide tape

SOT500-2

X

D

A

detail X

0

10

20 mm

DIMENSIONS (mm are the original dimensions)

scale

UNIT

mm

A (1)

max.

0.33

D

35.05

34.95

For unspecified dimensions see PLLMC-drawing given in the subpackage code.

Note

1. Total package thickness, exclusive punching burr.

OUTLINE

VERSION

IEC

REFERENCES

JEDEC

JEITA

EUROPEAN

PROJECTION

SOT500-2

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ISSUE DATE

03-09-17

06-05-22

Fig 20. Package outline SOT500-2

MF1S5009

Product data sheet

PUBLIC

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 27 July 2010

189131

© NXP B.V. 2010. All rights reserved.

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