FODB101 Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza

componentes Descripción

Fabricante

FODB101

Single Channel Microcoupler™

Fairchild Semiconductor 

Recommended Infrared Reflow Soldering Profile

Entrance

Zone 1

Zone 2

Zone 3

Zone 4

Zone 5 Cooling

270.00

236.25

202.50

168.75

135.00

101.25

67.50

33.75

0.00

0.66 1.31 1.97 2.63 3.28 3.94 4.60 5.26 5.91 6.57 7.23 7.88

Time (min.)

Reflow Profile for Pb Free

Average ramp-up rate (183°C to peak)

Preheat Temperature 125(±25)°C to 200°C

Temperature maintained above 220°C

Time within 5°C of actual peak temperature

Peak temperature range

Ramp down rate

Time 25°C to peak temperature

Convection Reflow

3°C/sec max

60-180°C

60-150 sec

20-40 sec

260 ±5°C

6°C/sec max

8min max

Note: Surface Mount Adhesives (SMA) isn’t recommended to be used on the dome area (white dome).

7

FODB100, FODB101, FODB102 Rev. 1.0.0

www.fairchildsemi.com

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